{"id":150278,"date":"2025-06-13T17:53:34","date_gmt":"2025-06-13T17:53:34","guid":{"rendered":"https:\/\/teknomers.com\/en\/the-u-s-claims-that-huawei-will-not-be-able-to-manufacture-more-than-200000-ai-chips-by-2025-we-know-the-reason-behind-this\/"},"modified":"2025-06-13T17:53:35","modified_gmt":"2025-06-13T17:53:35","slug":"the-u-s-claims-that-huawei-will-not-be-able-to-manufacture-more-than-200000-ai-chips-by-2025-we-know-the-reason-behind-this","status":"publish","type":"post","link":"https:\/\/teknomers.com\/en\/the-u-s-claims-that-huawei-will-not-be-able-to-manufacture-more-than-200000-ai-chips-by-2025-we-know-the-reason-behind-this\/","title":{"rendered":"The U.S. claims that Huawei will not be able to manufacture more than 200,000 AI chips by 2025. We know the reason behind this."},"content":{"rendered":"\n<p>Jeffrey Kessler, the \u00a0Deputy Undersecretary of Commerce for Industry and Security\u00a0 at the U.S. Department of Commerce, recently made a significant statement before Congress. He indicated that, according to U.S. assessments, Huawei&#8217;s production capacity for Ascend chips will be \u00a0200,000 units or less\u00a0 by 2025, with the majority expected to serve firms within China. This announcement was a stark reminder of the ongoing technological divide and the fierce competition in the artificial intelligence sector.<\/p>\n<p><!-- BREAK 1 --><\/p>\n<p>Furthermore, Kessler highlighted that \u00a0China is investing heavily\u00a0 in enhancing its AI chip production capabilities, particularly in Graphics Processing Units (GPUs). He emphasized the importance of recognizing this escalating challenge and advised against complacency. His statements directly reflect the \u00a0U.S. administration&#8217;s concerns\u00a0 about China&#8217;s rapid advancements in AI technology.<\/p>\n<p><!-- BREAK 2 --><\/p>\n<h2>China\u2019s Proximity in AI Technology<\/h2>\n<p>According to David Sacks, an AI and cryptocurrency expert and a former advisor to the Trump administration, China is only \u00a0three to six months behind the U.S.\u00a0 in AI technology. Despite initial alarms from his statement, the White House clarified that he was specifically referring to AI models. Thus, \u00a0Chinese chips\u00a0 are noted to still be about \u00a0one to two years behind\u00a0 their American counterparts. This nuanced understanding highlights the critical evaluation of the competition between the two nations.<\/p>\n<p><!-- BREAK 3 --><\/p>\n<div class=\"article-asset article-asset-normal article-asset-center\">\n<div class=\"desvio-container\">\n<div class=\"desvio\">\n<div class=\"desvio-figure js-desvio-figure\"><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<p>This week, Ren Zhengfei, the founder and CEO of Huawei, echoed these sentiments, stating that Huawei&#8217;s \u00a0Ascend GPUs are still a generation behind\u00a0 their American equivalents. While this statement aligns with U.S. government assessments, it&#8217;s imperative to note that Huawei invests over \u00a0$25 billion annually\u00a0 in AI hardware development, suggesting that they could soon catch up with industry leaders like NVIDIA and AMD.<\/p>\n<p><!-- BREAK 4 --><\/p>\n<div class=\"article-asset-summary article-asset-small article-asset-right\">\n<div class=\"asset-content\">\n<p class=\"sumario_derecha\">The wafer performance of the integration technologies employed by SMIC for Huawei\u2019s GPU production has ample room for improvement.<\/p>\n<\/p><\/div>\n<\/div>\n<p>Nevertheless, Kessler\u2019s prediction regarding Huawei&#8217;s AI chip production capacity rests upon a pivotal fact: the integration technologies utilized by \u00a0SMIC (Semiconductor Manufacturing International Corp)\u00a0 for producing Huawei\u2019s GPUs have significant room for improvement. Currently, SMIC can manufacture \u00a06 nm integrated circuits\u00a0 and is transitioning to \u00a05 nm semiconductors\u00a0, yet they face limitations due to the \u00a0deep ultraviolet lithography (DUV)\u00a0 equipment they possess.<\/p>\n<p><!-- BREAK 5 --><\/p>\n<p>It is commendable that the engineers at SMIC and Huawei have refined their processes to successfully produce chips at the \u00a05, 6, and 7 nm\u00a0 levels using ASML&#8217;s DUV equipment. However, it is unlikely that they will surpass the \u00a03 nm\u00a0 threshold with these machines. The technique they are employing, known as \u00a0multiple patterning\u00a0, comes with inherent limitations. This strategy generally entails transferring the pattern onto the wafer multiple times to enhance the lithographic resolution. Unfortunately, this approach often leads to increased costs for the chips and reduced production capacity.<\/p>\n<p><!-- BREAK 6 --><\/p>\n<p>This poses a significant challenge for Huawei, as not having access to the \u00a0cutting-edge technology\u00a0 required to manufacture semiconductors on par with leading firms like \u00a0Intel, TSMC\u00a0, and \u00a0Samsung\u00a0 greatly affects their competitive stance. To overcome these hurdles, Huawei is actively working on developing its own extreme ultraviolet (EUV) lithography equipment.<\/p>\n<p><!-- BREAK 7 --><\/p>\n<p>As global observers continue to monitor the \u00a0semiconductor landscape\u00a0, the difference in capabilities between the U.S. and China is increasingly significant, particularly in terms of AI advancements. Kessler&#8217;s remarks serve as a clear indication of the seriousness with which the U.S. administration regards China&#8217;s technological ascent. While challenges remain for Huawei and SMIC, their investment strategy and commitment to innovation could soon recalibrate the balance of power in the tech sector.<\/p>\n<p><br \/>\n<br \/><a href=\"https:\/\/teknomers.com\/category\/general\/\" rel=\"dofollow\">General News &#8211; 2<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Jeffrey Kessler, the \u00a0Deputy Undersecretary of Commerce for Industry and Security\u00a0 at the U.S. Department of Commerce, recently made a significant statement before Congress. He indicated that, according to U.S. assessments, Huawei&#8217;s production capacity for Ascend chips will be \u00a0200,000 units or less\u00a0 by 2025, with the majority expected to serve firms within China. This [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":150279,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[36399],"tags":[10052,1196,23553,23250,5087,24396],"class_list":["post-150278","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technology","tag-chips","tag-claims","tag-huawei","tag-manufacture","tag-reason","tag-u-s"],"_links":{"self":[{"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/posts\/150278","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/comments?post=150278"}],"version-history":[{"count":0,"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/posts\/150278\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/media\/150279"}],"wp:attachment":[{"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/media?parent=150278"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/categories?post=150278"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/teknomers.com\/en\/wp-json\/wp\/v2\/tags?post=150278"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}