As global tensions rise, Huawei and Semiconductor Manufacturing International Corp (SMIC) are joining forces to support China’s semiconductor industry. Over the past two and a half years, U.S. government sanctions have aimed to stifle the growth of Chinese companies involved in the design and manufacturing of integrated circuits . Although there are hundreds of semiconductor firms in China, Huawei and SMIC stand out as key players that are leading the charge.
Their prominence stems from the fact that they are likely to have the most resources available for innovation. And they are indeed innovating. Currently, SMIC has the capability to manufacture integrated circuits at 6 and 7 nm processes. Excitingly, they are about to commence production of 5 nm chips and are planning to initiate their first 3 nm nodes equipped with Gate-All-Around (GAA) transistors by 2026. This is particularly impressive considering that Chinese chip manufacturers lack access to Extreme Ultraviolet (EUV) lithography equipment from ASML, which is essential for producing advanced semiconductors.
The Kirin 9020 SoC: A Mixed Success
The launch of Huawei’s new Pura 80 smartphone series prompts an examination of their System on Chip (SoC) to uncover its offerings and the integration technology involved in its manufacturing. This chip has been produced by SMIC using its 7 nm process and N+2 class technology. This terminology indicates that it employs a second-generation 7 nm lithographic process, differentiating it from the SoC Kirin 9000S integrated into Huawei’s Mate 60 Pro smartphone.
SMIC is now capable of producing integrated circuits at 6 nm, with plans to manufacture 5 nm chips soon.
While we have yet to test any of the Pura 80 smartphones equipped with this SoC, it’s reasonable to expect it to deliver a satisfactory user experience. However, it’s clear that its performance per watt ratio will not match that of SoCs manufactured by TSMC using their 3 and 5 nm nodes. As previously mentioned, SMIC currently can produce integrated circuits at 6 nm and soon 5 nm, but they are constrained by the capabilities of their deep ultraviolet lithography (DUV) equipment.
It’s commendable that engineers from SMIC and Huawei have refined their integrated circuit manufacturing processes sufficiently to produce chips at 5, 6, and 7 nm using ASML’s DUV equipment. However, it’s highly unlikely that they will push beyond 3 nm with this technology, primarily because of the limitations posed by the multiple patterning technique they are employing. This method involves transferring the pattern onto the wafer multiple times to enhance lithographic resolution.
The downside is that this approach often leads to increased chip costs and reduced production capacity. For China, the inability to access the cutting-edge technology needed to fabricate semiconductors comparable to those made by Intel , AMD , or Qualcomm remains a significant challenge. The country’s primary hope is to develop its own EUV lithography equipment , and recent developments indicate they may be closer to achieving this. A leak has suggested that Huawei is already testing a prototype of one of these machines. If this information is confirmed and China rolls out commercial EUV machines by 2026, it would mark a critical step in its competition with the United States.
In summary, the collaboration between Huawei and SMIC is pioneering significant advancements in the semiconductor sector, but challenges remain as they strive for innovation without access to the most advanced lithography technology. The outcomes of their efforts will play a vital role in defining the future of the industry in China and beyond.