SMIC (Semiconductor Manufacturing International Corp) stands as the largest semiconductor manufacturer in China, currently holding a market share of slightly over 5%. This positions it closely to global players such as Samsung, which has a share of 7.2%, while it ranks third overall, ahead of Intel, GlobalFoundries, and UMC. In September 2023, SMIC made headlines by officially announcing the production of the Kirin 9000S SoC for Huawei using ASML’s deep ultraviolet (UVP) lithography equipment, marking a significant milestone in chip manufacturing.
US Government Scrutiny
This breakthrough has attracted the attention of the US government, which did not anticipate that a Chinese semiconductor manufacturer could achieve such advanced production capabilities without access to ASML’s extreme ultraviolet (EUV) photolithography machines. Existing sanctions from the US and the Netherlands restrict the delivery of advanced equipment to Chinese manufacturers, necessitating that SMIC innovate in its semiconductor production strategies.
Multiple Patterning Technique
The 7nm integrated circuits developed by SMIC leverage the well-known multiple patterning technique, which involves transferring patterns to a wafer in several passes to enhance lithographic resolution. Although this method increases chip costs and reduces production capacity, it has proven effective. SMIC has developed the N+3 node technology, currently being used to manufacture the HiSilicon Kirin 9030.
Logical Density Achievement
Remarkably, SMIC has achieved the logical density of TSMC’s N6 node, a feat thought unlikely just three years ago. According to a report from SemiAnalysis, SMIC’s N+3 technology reaches a transistor density of 113.4 MTr/mm², slightly outperforming TSMC’s density of 107.7 MTr/mm², despite lacking access to EUV lithography. This achievement stands as a testament to the innovation and engineering prowess of SMIC, utilizing tools from an earlier generation effectively.
Cross-Sectional Analysis
Cross-sectional images of the chip confirm SMIC’s advancements. The N+3 node exhibits transistors with taller, narrower ends compared to TSMC’s N6 node, achieving an aspect ratio of 9.5:1 versus 7.8:1. Additionally, the logic cells are 5% lower, indicating a refined design that optimizes space and efficiency. SMIC has implemented several optimization techniques, including eliminating unnecessary ends, directly connecting contacts to the active gate, and surgical diffusion cutting.
Challenges and Adaptations
While SMIC has made significant strides, the lack of EUV lithography has come at a price, manifesting as higher production costs, lower process maturity, and decreased energy efficiency. Huawei has deftly navigated these challenges by enhancing chip architecture, advanced packaging options, and other optimizations to compensate for the limitations of SMIC’s lithographic capabilities.
Distribution of Knowledge
In response to the evolving challenges posed by export controls, the Chinese government has mandated SMIC to license its N+2 and N+3 processes to Hua Hong Semiconductor. This move is transforming what was once a concentrated advantage into a broader semiconductor ecosystem asset, thus diminishing the effectiveness of sanctions aimed at isolating SMIC.
In conclusion, SMIC’s achievements mark a pivotal moment in the semiconductor industry, showcasing both the potential and the challenges posed by geopolitical pressures. As knowledge of advanced manufacturing spreads, not only does it pave the way for SMIC, but it also promises to reshape the global semiconductor landscape in the coming years.
Image | SMIC